Growth competition between layer-type and porous-type Cu 3 Sn in microbumps - Concepedia

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Growth competition between layer-type and porous-type Cu 3 Sn in microbumps

29

Citations

13

References

2017

Year

David T. Chu, Yi‐Cheng Chu, Jie-An Lin, Yi‐Ting Chen, Chun‐Chieh Wang, Yen‐Fang Song, Cheng-Cheng Chiang, Chih Chen, K. N. Tu

Microelectronics Reliability

Materials EngineeringMaterials SciencePorous-type Cu 3EngineeringNanoporous MaterialNanomaterialsNanotechnologySurface ScienceApplied PhysicsNanostructure SynthesisNanoscale ScienceGrowth CompetitionMicrostructure

References

	Year	Citations

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