Advanced Embedded Packaging for Power Devices

Abstract

Power electronics has a great popularity in many industrial fields. Recently, in automotive, the demand for power packages in electric and hybrid vehicles has been extremely rising. Those devices are required to have high thermal performance. However, conventional power device packages using wire assembly techniques have difficulty to meeting the requirements. To solve the problem, a new and expandable advanced package for power devices was developed using embedded dies and redistribution layer (RDL) technology. The new package has a low electrical resistance and good thermal performance due to heat dissipation through many via holes. A test vehicle was, designed and fabricated around the via structures' process parameters. A fixed aspect ratio was used for the copper-filling plating and die attach film (DAF) material to provide sufficient adhesion. A fabricated test vehicle (TV) sample with embedded test element group (TEG) chip and live-die confirmed that the via structure is completely filled and connected correctly by the simple I-V curve measurements on this package. With its demonstrated thermal performance, this package should have many applications for future power devices.