Enhanced thermoelectric properties of screen-printed Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub> and Bi<sub>2</sub>Te<sub>2.7</sub>Se<sub>0.3</sub> thick films using a post annealing process with mechanical pressure - Concepedia

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Enhanced thermoelectric properties of screen-printed Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub> and Bi<sub>2</sub>Te<sub>2.7</sub>Se<sub>0.3</sub> thick films using a post annealing process with mechanical pressure

47

Citations

26

References

2017

Year

Hyeongdo Choi, Sun Jin Kim, Yongjun Kim, Ju Hyung We, Min‐Wook Oh, Byung Jin Cho

Journal of Materials Chemistry C

Thin Film PhysicsEngineeringMaterial InnovationThin Film Process TechnologyMechanical PressureEnhanced Thermoelectric PropertiesMaterials FabricationPrinted ElectronicsElectronic PackagingThin Film ProcessingMaterials EngineeringMaterials ScienceScreen-printing ProcessMaterial Property3D PrintingMaterial AnalysisElectronic MaterialsNatural SciencesSurface ScienceApplied PhysicsMaterials CharacterizationThermoelectric MaterialTe DeviceMaterial PerformanceThin FilmsFunctional Materials

Abstract

We report on a TE device composed of p-type Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub> and n-type Bi<sub>2</sub>Te<sub>2.7</sub>Se<sub>0.3</sub> TE materials prepared using a screen-printing process.

References

	Year	Citations

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