Concepedia

Publication | Closed Access

Experiments and reliability research on bonding process of micron copper wire and nanometer gold layer

DOI

13

Citations

8

References

2017

Year

W. W. Zhang, Shuo Cong, Zhengmao Wen, Y. Liu, Y. S. Wang, Yanhong Tian
The International Journal of Advanced Manufacturing Technology

References

YearCitations

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