The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics

Marta Kuczynska, N. Schafet, U. Becker, B. Métais, A. Kabakchiev, Patrick M. Buhl, Stefan Weihe

Microelectronics Reliability · 2017 · 15 citations · 18 references

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