RSC Advances · 2017 · 71 citations · 43 references
EngineeringMaterials EngineeringMaterials ScienceMaterials ProcessingSurface EngineeringSurface ScienceAbrasive WearEtching ProcessesSemiconductor SurfacesSurface HardeningSurface ModificationSurface PhysicsAbrasive ParticlesChemical Mechanical PlanarizationMechanical AbrasionPlanarizationSilicon CarbideSilicon Carbide (Sic) MaterialsSilicon EtchingSilicon Wafer Processing
The interactions between abrasive particles and the wafer surface play a significant role in the chemical-mechanical planarization (CMP) process.
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The DLVO theory in microbial adhesion
Malte Hermansson · Colloids and Surfaces B Biointerfaces · 1999 · 974 citations
Mechanism of polishing of SiO2 films by CeO2 particles
Tetsuya Hoshino, Y. Kurata, Yuuki Terasaki et al. · Journal of Non-Crystalline Solids · 2001 · 306 citations
Natural Sciences, Materials Engineering, Materials Science +14