Applied Physics Letters · 2017 · 68 citations · 29 references
EngineeringElectrical EngineeringMaterials ScienceOptoelectronicsSemiconductor DevicesSemiconductor MaterialsDopingLight-emitting DiodesP-n JunctionsSemiconductor Device MaterialsSemiconductor HeterostructuresSemiconductor PhysicsAnnealingBlue Light-emitting DiodesElectroluminescenceGallium NitrideMetalorganic Vapor Phase EpitaxySeries ResistanceThermal AnnealingTunnel Junctions
We report on III-Nitride blue light emitting diodes (LEDs) comprising a GaN-based tunnel junction (TJ) all realized by metalorganic vapor phase epitaxy in a single growth process. The TJ grown atop the LED structures consists of a Mg-doped GaN layer and subsequently grown highly Ge-doped GaN. Long thermal annealing of 60 min at 800 °C is important to reduce the series resistance of the LEDs due to blockage of acceptor-passivating hydrogen diffusion through the n-type doped top layer. Secondary ion mass spectroscopy measurements reveal Mg-incorporation into the topmost GaN:Ge layer, implying a non-abrupt p-n tunnel junction and increased depletion width. Still, significantly improved lateral current spreading as compared to conventional semi-transparent Ni/Au p-contact metallization and consequently a more homogeneous electroluminescence distribution across 1 × 1 mm2 LED structures is achieved. Direct estimation of the depletion width is obtained from electron holography experiments, which allows for a discussion of the possible tunneling mechanism.
29
Hole Compensation Mechanism of P-Type GaN Films
Shuji Nakamura, Naruhito Iwasa, Masayuki Senoh et al. · Japanese Journal of Applied Physics · 1992 · 1.1K citations
Electron holography—basics and applications
Hannes Lichte, Michael Lehmann · Reports on Progress in Physics · 2007 · 345 citations
Role of hydrogen in doping of GaN
Jörg Neugebauer, Chris G. Van de Walle · Applied Physics Letters · 1996 · 339 citations