Publication | Closed Access
Effect of substrate bias on deposition behaviour of charged silicon nanoparticles in ICP-CVD process
14
Citations
43
References
2016
Year
Crystalline NanoparticlesEngineeringChemistryChemical DepositionSilicon On InsulatorPlasma ProcessingSemiconductorsChemical EngineeringNanoengineeringDeposition BehaviourSilicon NanoparticlesThin Film ProcessingMaterials ScienceSubstrate BiasNanotechnologySemiconductor Device FabricationCrystalline Silicon FilmsElectronic MaterialsNanomaterialsSurface ScienceApplied PhysicsThin FilmsChemical Vapor DepositionSolar Cell Materials
The effect of a substrate bias on the deposition behaviour of crystalline silicon films during inductively coupled plasma chemical vapour deposition (ICP-CVD) was analysed by consideration of non-classical crystallization, in which the building block is a nanoparticle rather than an individual atom or molecule. The coexistence of positively and negatively charged nanoparticles in the plasma and their role in Si film deposition are confirmed by applying bias voltages to the substrate, which is sufficiently small as not to affect the plasma potential. The sizes of positively and negatively charged nanoparticles captured on a carbon membrane and imaged using TEM are, respectively, 2.7–5.5 nm and 6–13 nm. The film deposited by positively charged nanoparticles has a typical columnar structure. In contrast, the film deposited by negatively charged nanoparticles has a structure like a powdery compact with the deposition rate about three times higher than that for positively charged nanoparticles. All the films exhibit crystallinity even though the substrate is at room temperature, which is attributed to the deposition of crystalline nanoparticles formed in the plasma. The film deposited by negatively charged nanoparticles has the highest crystalline fraction of 0.84.
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