Publication | Closed Access
High-Performance RF Devices and Components on Flexible Cellulose Substrate by Vertically Integrated Additive Manufacturing Technologies
42
Citations
32
References
2016
Year
EngineeringMetal Adhesive LaminateMechanical EngineeringAdvanced ManufacturingHigh-performance Rf DevicesFlexible Cellulose SubstrateComputational FabricationAdvanced Packaging (Semiconductors)Materials FabricationPrinted ElectronicsElectronic PackagingMaterials ScienceElectrical EngineeringNovel Additive ManufacturingAntennaFabrication TechniqueManufacturing EngineeringMaximum Inductance3D PrintingAdvanced PackagingFlexible ElectronicsMicrofabrication
This paper aims to demonstrate that novel additive manufacturing (AM) technologies like metal adhesive laminate and multilayer inkjet printing can be effectively exploited to fabricate high-performing radio-frequency passive components on flexible substrates. Both processes are substrate independent and therefore suitable for manufacturing circuits on several unconventional materials, such as photo-paper. In addition, their complementary features can be combined to develop a novel hybrid process. Proof-of-concept AM prototypes of passive components, such as capacitors and inductors, exhibiting quality factors over 70, never achieved before on paper, and self-resonant frequencies beyond 4 GHz are described. The maximum inductance and capacitance per unit area are 1.4 nH/mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and 6.5 pF/mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , respectively. Moreover, an AM RF mixer with a conversion loss below 10 dB is demonstrated still on paper substrate. The mixer, fabricated with the copper adhesive laminate method, operates at 1 GHz and exploits a lumped balun transformer connected to two packaged diodes in series.
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