2003 · 47 citations · 3 references
EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesVlsi DesignCmos Circuit DesignComplementary Metal-oxide-semiconductor TechnologyDevice CharacterizationDevice ScalingIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsCmos ReliabilityCmos ScalingGate LeakageGate Leakage CurrentGate Oxide LeakageGate Oxide Leakage ReductionJunction CapacitanceParasitic Capacitance
CMOS transistors with a 50 nm physical gate length are demonstrated. Super-halo, implemented by angle-tilted implantation, is utilized to control V/sub th/ roll-off down to a gate length of 40 nm. Super-halo also provides V/sub th/ adjustment as well as a retrograde channel to suppress subsurface body punch-through. 935 /spl mu/A//spl mu/m and 395 /spl mu/A//spl mu/m on-state drive currents were achieved for n- and p-channel MOSFETs, respectively, with a V/sub dd/ of 1.5 V. The I/sub drive//(C/sub ox(inv)/V/sub dd/) figure-of-merit (FOM) of the CMOS devices falls on the trend line extrapolated from existing industrial CMOS technologies. The impacts of super-halo on V/sub th/ roll-off, DIBL, gate overlap Miller capacitance and junction capacitance in a 50 nm MOSFET are investigated. Strong halo can result in drain-to-halo (body) band-to-band tunneling leakage even at room temperature. Degradation of gate oxide leakage and hot-carrier reliability due to large-angle-tilted halo implant are concerns in 50 nm CMOS transistors.
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25 nm CMOS design considerations
C. Wann, D.J. Frank · 2002 · 233 citations
A high performance 180 nm generation logic technology
Shih‐Chi Yang, Sally Ahmed, B. Arcot et al. · 2002 · 89 citations
Engineering, Computer Engineering, Electrical Engineering +17