Modular integration of high-performance SiGe:C HBTs in a deep submicron, epi-free CMOS process

Abstract

We will describe the first modular integration of a SiGe:C heterojunction bipolar transistor (SiGe:C HBTs) into a conventional 0.25 /spl mu/m, epi-free CMOS platform. The high temperature stability of base doping profiles in SiGe:C HBTs and an optimized collector linkage have allowed the modular integration of an npn device with f/sub T//f/sub max/ of 55/90 GHz into two variants of a conventional epi-free 0.25 /spl mu/m CMOS platform. In both cases, the original CMOS steps and the electrical parameters of the CMOS devices remain essentially unchanged. Yield and electrical characteristics of the integrated SiGe:C HBT are shown to be the same as those from a bipolar-only process.