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Ultrathin hafnium oxide with low leakage and excellent reliability for alternative gate dielectric application
146
Citations
8
References
2003
Year
Unknown Venue
EngineeringReliability CharacteristicsSemiconductor DeviceExcellent ReliabilityNanoelectronicsUltrathin HafniumLow LeakageMaterials EngineeringMaterials ScienceElectrical EngineeringOxide ElectronicsBias Temperature InstabilityTime-dependent Dielectric BreakdownDc MagnetronMicroelectronicsAlternative Gate DielectricStress-induced Leakage CurrentApplied PhysicsElectrical Insulation
Physical, electrical and reliability characteristics of ultra thin HfO/sub 2/ as an alternative gate dielectric were studied for the first time. Crucial process parameters of oxygen modulated dc magnetron sputtering were optimized to achieve an equivalent oxide thickness (EOT) of 11.5 /spl Aring/ without deducting the quantum mechanical effect. Leakage current was 3/spl times/10/sup -2/ A/cm/sup 2/ at +1 V. Excellent dielectric properties such as high dielectric constant, low leakage current, good thermal stability, negligible dispersion and good reliability were demonstrated.
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