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Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

Materials ScienceMaterials EngineeringSmall AdditionsEngineeringMaterial ProcessingCorrosionMicrofabricationMechanical EngineeringMetallurgical ProcessPost-rupture MicroanalysisNovel Lead-free SolderMicrostructureMetal Processing