Publication | Closed Access
Power cycling test and failure analysis of molded Intelligent Power IGBT Module under different temperature swing durations
55
Citations
14
References
2016
Year
Electrical EngineeringReliability EngineeringEngineeringHardware ReliabilityPower DeviceBias Temperature InstabilityFailure AnalysisCircuit ReliabilityPower ElectronicsDevice Reliability
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