Advances in Electroless Nickel Plating for the Metallization of Silicon Solar Cells Using Different Structuring Techniques for the ARC

Abstract

This paper presents the results of a seed and plate technology, based on electroless nickel plating on industrial substrates. Through the photoassisted surface activation of the cells homogeneous NiP coatings, about 30-50 nm thick have been deposited. The combination of this step with inkjet masking and etching has been compared with laser ablation and with standard screen printed cells on industrial solar cells. An improvement of 0.5% absolute in efficiency has been achieved thanks to the use of nickel contacts. The advantages and disadvantages of each structuring process are introduced. The evaluation of the laser ablation + nickel process on high efficiency structures has delivered FF over 80%.