MULTI-LAYER THIN-FILM MCM-D FOR THE INTEGRATION OF HIGH PERFORMANCE WIRELESS FRONT-END SYSTEMS - Concepedia

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MULTI-LAYER THIN-FILM MCM-D FOR THE INTEGRATION OF HIGH PERFORMANCE WIRELESS FRONT-END SYSTEMS

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Citations

0

References

2001

Year

G. Carchon, Bart Nauwelaers, P. Pieters, Kristof Vaesen, W. De Raedt, Eric Beyne

Microwave journal

3D Ic ArchitectureElectrical EngineeringEngineeringDevice IntegrationFlexible ElectronicsMicrofabricationAdvanced Packaging (Semiconductors)Multi-layer Thin-film Mcm-dComputer EngineeringElectronic PackagingThin FilmsMicroelectronicsInterconnect (Integrated Circuits)Electromagnetic Compatibility

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