Improved performances of AlN/polyimide hybrid film and its application in redistribution layer

Foreword contributions from the 50th electronic components and technology conference

R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations

Engineering, Computer Engineering, Electrical Engineering +16

3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems

Jian‐Qiang Lu · Proceedings of the IEEE · 2009 · 313 citations

Engineering, Manufacturing Engineering, Materials Science +17

Effects of interfacial thermal barrier resistance and particle shape and size on the thermal conductivity of AlN/PI composites

Xiaosu Yi · Composites Science and Technology · 2004 · 185 citations

Natural Sciences, Materials Engineering, Materials Science +16

Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging

Yongcun Zhou, Hong Wang, Lu Wang et al. · Materials Science and Engineering B · 2012 · 124 citations

Natural Sciences, Materials Engineering, Materials Science +17

New composites with high thermal conductivity and low dielectric constant for microelectronic packaging

Wei Ling, Aijuan Gu, Guozheng Liang et al. · Polymer Composites · 2009 · 77 citations

Natural Sciences, Materials Engineering, Materials Science +17