Publication | Closed Access

Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)Flip-chip Solder JointsMicrofabricationLaminography ObservationChip On BoardMechanical EngineeringDiscrete VoidsChip AttachmentElectronic PackagingMicroelectronics3D Printing