Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Recent advances on electromigration in very-large-scale-integration of interconnects

K. N. Tu · Journal of Applied Physics · 2003 · 1.1K citations

Engineering, Electrical Engineering, Materials Science +17

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 363 citations

Engineering, Electrical Engineering, Materials Science +17

Recent developments in X-ray imaging with micrometer spatial resolution

Thierry Martin, Andreas Koch · Journal of Synchrotron Radiation · 2006 · 323 citations · Full text

Engineering, Materials Science, Photonics +16

Three-dimensional visualization and microstructure-based modeling of deformation in particle-reinforced composites

Nikhilesh Chawla, R. Sidhu, V.V. Ganesh · Acta Materialia · 2006 · 284 citations

Natural Sciences, Materials Engineering, Materials Science +16