Study of direct Cu electrodeposition on ultra-thin Mo for copper interconnect

Theoretical and experimental studies of multiple nucleation

B.R. Scharifker, Graham Hills · Electrochimica Acta · 1983 · 2.2K citations

Natural Sciences, Materials Science, Physics +11

Electrodeposition of copper: the nucleation mechanisms

Darko Grujičić, Batrić Pešić · Electrochimica Acta · 2002 · 698 citations

Natural Sciences, Chemistry, Materials Science +11

Pitting corrosion behaviour of austenitic stainless steels – combining effects of Mn and Mo additions

A. Pardo, M.C. Merino, A.E. Coy et al. · Corrosion Science · 2008 · 544 citations

Natural Sciences, Materials Engineering, Materials Science +16

Electrodeposition of Copper Thin Film on Ruthenium

Oliver Chyan, Tiruchirapalli Arunagiri, Thomas Ponnuswamy · Journal of The Electrochemical Society · 2003 · 237 citations

Natural Sciences, Materials Engineering, Materials Science +17

The effect of molybdenum oxide interlayer on organic photovoltaic cells

Do Young Kim, Jegadesan Subbiah, Galileo Sarasqueta et al. · Applied Physics Letters · 2009 · 212 citations

Natural Sciences, Materials Engineering, Materials Science +17