Li-Ao Cao

Study of a single layer ultrathin CoMo film as a direct plateable adhesion/barrier layer for next generation interconnect

Xin-Ping Qu, Xu Wang, Li-Ao Cao et al. · 2014 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +14

Aluminum tri-isopropoxide as an alternative precursor for atomic layer deposition of aluminum oxide thin films

Fatemeh Hashemi, Li-Ao Cao, Felix Mattelaer et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2019 · 16 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Study of direct Cu electrodeposition on ultra-thin Mo for copper interconnect

Xu Wang, Li-Ao Cao, Guang Yang et al. · Microelectronic Engineering · 2016 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +16

Atomic Layer Deposition of Al₂O₃ Using Aluminum Triisopropoxide (ATIP): A Combined Experimental and Theoretical Study

Truong Ba Tai, Li-Ao Cao, Felix Mattelaer et al. · The Journal of Physical Chemistry C · 2018 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +16