Bond pad cratering study by reliability tests

Development of copper wire bonding application technology

K. Toyozawa, Kazuya Fujita, S. Minamide et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 105 citations

Materials Engineering, Materials Science, Electrical Engineering +13

A comparison of copper and gold wire bonding on integrated circuit devices

S.L. Khoury, D.J. Burkhard, David Galloway et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 98 citations

Engineering, Device Integration, Reliability Results +16

Optimization of copper wire bonding on Al-Cu metallization

Luu Nguyen, David B. McDonald, A.R. Danker et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 80 citations

Materials Engineering, Materials Science, Electrical Engineering +14

The effect of high-temperature intermetallic growth on ball shear-induced cratering

G. V. Clatterbaugh, Harry K. Charles · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 33 citations

High-temperature Intermetallic Growth, Engineering, Severe Plastic Deformation +21

A Bond Failure Mechanism

Tim Koch, Wayne Richliug, J. H. Whitlock · Reliability physics · 1986 · 31 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +16