Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder

Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

Tomi Laurila, Vesa Vuorinen, Mervi Paulasto‐Kröckel · Materials Science and Engineering R Reports · 2010 · 335 citations

Natural Sciences, Materials Engineering, Materials Science +14

The Cu-Sn (Copper-Tin) system

Nigel J. Saunders, A. P. Miodownik · Bulletin of Alloy Phase Diagrams · 1990 · 327 citations

Natural Sciences, Materials Engineering, Materials Science +6

Thermodynamic Assessment of the Cu-Sn System

Jeong Hyun Shim, Ch.-S. Oh, Byeong‐Joo Lee et al. · International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) · 1996 · 224 citations

Natural Sciences, Chemistry, Materials Science +17

The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

Guang Zeng, Stuart D. McDonald, Qinfen Gu et al. · Acta Materialia · 2014 · 168 citations

Natural Sciences, Materials Engineering, Materials Science +17

Phase equilibria and solidification properties of Sn-Cu-Ni alloys

Chih‐Hao Lin, Sinn-wen Chen, Chao-hong Wang · Journal of Electronic Materials · 2002 · 164 citations

Engineering, Materials Engineering, Materials Science +16