Crystal Growth & Design · 2014 · 56 citations · 17 references
Natural SciencesMaterials EngineeringMaterials ScienceComputational Materials ScienceElectronic MaterialsHeat TransferCrystal GrowthDislocation MechanicsDislocations In SemiconductorsHeat Transfer ModelingSemiconductor Crystal GrowthStacking FaultsCoolingCooling Rate EffectsDislocation DynamicsDislocation PhysicsDislocationsSilicon Carbide (Sic) MaterialsSilicon Carbide Crystal GrowthStacking Fault Effects
To effectively reduce basal plane dislocations (BPDs) during SiC physical vapor transport growth, a three-dimensional model for tracking the multiplication of BPDs has been developed. The distribution of BPDs inside global crystals has been shown. The effects of the convexity of the growth surface and the cooling rate have been analyzed. The results show that the convexity of the growth surface is unfavorable and can cause a large multiplication of BPDs when the crystal grows. Fast cooling during the cooling process is beneficial for the reduction of BPDs because fast cooling can result in a smaller radial flux at the high-temperature region. In addition, fast cooling can reduce the generation of stacking faults during the cooling process. Therefore, to reduce BPDs and stacking faults, it is better to maintain or reduce the convexity of the growth surface and increase the cooling rate during the cooling process.
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Long Term Operation of 4.5kV PiN and 2.5kV JBS Diodes
H. Lendenmann, Fanny Dahlquist, Nils Johansson et al. · Materials science forum · 2001 · 262 citations
Engineering, Electrical Engineering, Semiconductor Devices +4
Dislocation glide motion in 6H SiC single crystals subjected to high-temperature deformation
Satoshi Fujita, Koji Maeda, Shin-ichi Hyodo · Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties · 1987 · 102 citations
Natural Sciences, Materials Engineering, Materials Science +17