Microelectronics Reliability · 2016 · 12 citations · 23 references
Materials ScienceEngineeringMechanical BehaviorMechanical EngineeringFatigue Delamination CharacterizationStressstrain AnalysisMicroelectronic PackagesElectronic PackagingIn-situ Numerical–experimental ApproachLow-cycle FatigueMechanics Of Materials
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