Publication | Closed Access
High Resolution Observation of Void Motion in Passivated Metal Lines Under Electromigration Stress
36
Citations
2
References
1992
Year
Electrical EngineeringElectromigration TechniqueEngineeringSurface ScienceMechanical EngineeringApplied PhysicsPassivated Metal LinesMetallurgical InteractionInterconnect (Integrated Circuits)High Resolution ObservationElectronic PackagingMicroelectronicsVoid MotionElectrical InsulationInterface Phenomenon
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