Ablation of Submicrometer Holes Using an Extreme-Ultraviolet Laser

Abstract

Advanced mesoscale devices require tight tolerances of very fine features. Laser ablation is widely used for this purpose, and extreme-ultraviolet (EUV) lasers in particular allow for a tighter focus and lower-temperature machining than traditional lasers. The authors perform simulations and experiments of laser ablation using an EUV laser, producing high-aspect-ratio mesoscale (100 nm---1\textmu{}m) features with a high level of control over the ablation profile. This work provides an effective technique to investigate and promote capillary-discharge laser technology for industrial processes.