Inkjet Fabrication of Copper Patterns for Flexible Electronics: Using Paper with Active Precoatings

Abstract

Low-cost solution-processing of highly conductive films is important for the expanding market of printed electronics. For roll-to-roll manufacturing, suitable flexible substrates and compatible postprocessing are essential. Here, custom-developed coated papers are demonstrated to facilitate the inkjet fabrication of high performance copper patterns. The patterns are fabricated in ambient conditions using water-based CuO dispersion and intense pulsed light (IPL) processing. Papers using a porous CaCO3 precoating, combined with an acidic mesoporous absorption coating, improve the effectiveness and reliability of the IPL process. The processing is realizable within 5 ms, using a single pulse of light. A resistivity of 3.1 ± 0.12 μΩ·cm is achieved with 400 μm wide conductors, corresponding to more than 50% of the conductivity of bulk copper. This is higher than previously reported results for IPL-processed copper.