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Microstructure of Electrodeposited Cu Micro-cylinders in High-Aspect-Ratio Blind Holes and Crystallographic Texture of the Cu Overburden Film

Materials ScienceEngineeringMicrofabricationSurface ScienceApplied PhysicsElectrodeposited Cu Micro-cylindersCu Overburden FilmHigh-aspect-ratio Blind HolesMicrostructure