Yazhou Zhang

Effect of External Factors on Copper Filling in 3D Integrated Through-Silicon-Vias (TSVs)

Yazhou Zhang, Guifu Ding, Hong Wang et al. · Journal of The Electrochemical Society · 2015 · 39 citations

Engineering, External Factors, Integrated Through-silicon-vias +19

Evaluation of flexible pavement deterioration conditions using deflection profiles under moving loads

Yong Deng, Xue Luo, Yazhou Zhang et al. · Transportation Geotechnics · 2020 · 39 citations

Geotechnical Engineering, Highway Pavement, Pavements +10

Moxifloxacin-isatin Hybrids Tethered by 1,2,3-triazole and their Anticancer Activities

Mingli Yang, Hailin Liu, Yazhou Zhang et al. · Current Topics in Medicinal Chemistry · 2020 · 38 citations

Numerical Simulation and Mechanism Analysis of Through-Silicon Via (TSV) Filling Using an Arbitrary Lagrange-Eulerian (ALE) Method

Yazhou Zhang, Yunna Sun, Guifu Ding et al. · Journal of The Electrochemical Society · 2015 · 34 citations

Engineering, Mechanical Engineering, Computational Mechanics +25

Numerical Simulation and Experimental Verification of Additive Distribution in Through-Silicon Via during Copper Filling Process

Yazhou Zhang, Guifu Ding, Ping Cheng et al. · Journal of The Electrochemical Society · 2014 · 32 citations

Engineering, Mechanical Engineering, Through-silicon Via +19