Yazhou Zhang - Concepedia

Author

Yazhou Zhang

Shanghai Jiao Tong University

Also Known As

Yazhou Zhang

Publications

363

Citations

H-Index

Concepts

All Affiliations

Shanghai Jiao Tong University Lanzhou University of Technology

About

Yazhou Zhang is an author at Shanghai Jiao Tong University specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	11	283
2	Applied Physics	6	6	166
3	Computer Engineering	2	2	46
4	Chemistry	1	1	22
5	Civil Engineering	1	1	39

Yazhou Zhang

Publications

341

Citations

H-Index

Page 1

	Year	Citations
Effect of External Factors on Copper Filling in 3D Integrated Through-Silicon-Vias (TSVs) Yazhou Zhang, Guifu Ding, Hong Wang, Journal of The Electrochemical Society EngineeringExternal FactorsIntegrated Through-silicon-viasForced ConvectionInterconnect (Integrated Circuits)	2015	39
Evaluation of flexible pavement deterioration conditions using deflection profiles under moving loads Yong Deng, Xue Luo, Yazhou Zhang, Transportation Geotechnics Geotechnical EngineeringHighway PavementPavementsEngineeringCivil Engineering	2020	39
Moxifloxacin-isatin Hybrids Tethered by 1,2,3-triazole and their Anticancer Activities Mingli Yang, Hailin Liu, Yazhou Zhang, Current Topics in Medicinal Chemistry	2020	38
Numerical Simulation and Mechanism Analysis of Through-Silicon Via (TSV) Filling Using an Arbitrary Lagrange-Eulerian (ALE) Method Yazhou Zhang, Yunna Sun, Guifu Ding, Journal of The Electrochemical Society EngineeringMechanical EngineeringComputational MechanicsSilicon On InsulatorThrough-silicon Via	2015	34
Numerical Simulation and Experimental Verification of Additive Distribution in Through-Silicon Via during Copper Filling Process Yazhou Zhang, Guifu Ding, Ping Cheng, Journal of The Electrochemical Society EngineeringMechanical EngineeringThrough-silicon ViaCurvature-enhanced Accelerator CoverageAdvanced Packaging (Semiconductors)	2014	32
Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs) Yazhou Zhang, Guifu Ding, Hong Wang, Journal of Micromechanics and Microengineering EngineeringIntegrated CircuitsIntegrated Through-silicon ViasInterconnect (Integrated Circuits)Physical Design (Electronics)	2015	26
Microstructure of Electrodeposited Cu Micro-cylinders in High-Aspect-Ratio Blind Holes and Crystallographic Texture of the Cu Overburden Film Yazhou Zhang, Guifu Ding, Hong Wang, Journal of Material Science and Technology Materials ScienceEngineeringMicrofabricationSurface ScienceApplied Physics	2015	22
Design and synthesis of two energetic coordination polymers based on copper ion and 1H,1′H-[5,5′-bitetrazole]-1,1′-diol: A comparative study of the structure-property relationships Zhaoqi Guo, Xuemin Liu, Xiang Chen, Journal of Solid State Chemistry Materials ScienceInorganic ChemistryEnergetic Coordination PolymersEngineeringCopper Ion	2018	22
Remaining useful life prediction of bearings based on temporal convolutional networks with residual separable blocks Yazhou Zhang, Xiaoqiang Zhao Journal of the Brazilian Society of Mechanical Sciences and Engineering EngineeringMachine LearningData ScienceLife PredictionPredictive Maintenance	2022	21
Design Matching and Dynamic Performance Test for an HST-Based Drive System of a Hillside Crawler Tractor Zhijie Liu, Guoqiang Zhang, Guoping Chu, Agriculture Geotechnical EngineeringEnergy Efficient DriveEngineeringDesign MatchingMechanical Engineering	2021	20

Page 1