Concepedia

Publication | Open Access

A thermal cycling reliability study of ultrasonically bonded copper wires

DOIFull Paper Access

21

Citations

11

References

2016

Year

Elaheh Arjmand, Pearl Agyakwa, Martin Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson
Microelectronics Reliability

References

YearCitations

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