Lock-In IR-Thermography – A Novel Tool for Material and Device Characterization

S. Huth, Otwin Breitenstein, Arthur Huber, D. Dantz, U. Lambert, Frank Altmann

Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 2001 · 83 citations · 0 references

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Abstract

A novel non-destructive and non-contacting technique for the spatially resolved detection of small leak-age currents in electronic devices and MOS materials is presented. Highly-sensitive lock-in infrared (IR-) thermography is used to localize leak-age current induced temperature variations down to 10 muK at a lateral resolution down to 5 mum. Leakage currents of about 1 mA can be localized within seconds and some muA may be detected after less than 1 h measurement.