Publication | Closed Access
Interconnect Modeling and Analysis in the Nanometer Era: Cu and Beyond
20
Citations
0
References
2005
Year
Unknown Venue
New TechnologiesEngineeringVlsi DesignPower ElectronicsInterconnect (Integrated Circuits)Interconnect ModelingNanoelectronicsParasitic ExtractionNanoscale ModelingElectronic PackagingDevice Modeling3D Ic ArchitectureElectrical EngineeringElectromigration TechniquePhysicsComputer EngineeringMicroelectronicsVlsi ArchitectureApplied PhysicsNanometer Era
This paper highlights key emerging issues in the domain of interconnect modeling and analysis. The implications of various nanoscale effects on VLSI interconnect performance, reliability, power dissipation and parasitic extraction are also presented. Finally, promising new technologies are outlined which have the potential to meet these interconnect challenges in the nanometer era.