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Evaluation of Single Phase Flow in Microchannels for High Flux Chip Cooling: Thermohydraulic Performance Enhancement and Fabrication Technology
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2004
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Unknown Venue
EngineeringLiquid Metal CoolingIntegrated CircuitsRefrigerationHeat Transfer ProcessFabrication TechnologyElectronic PackagingMicrofluidicsDirect Liquid Cooling3D Ic ArchitectureMultiphase FlowHeat TransferMicroelectronicsSingle Phase FlowMicro TechnologyAdvanced PackagingThermohydraulic Performance EnhancementMicrofabricationHeat Transfer EnhancementThermal ManagementComputer ChipsCircuit DensityThermal Engineering
The increased circuit density on today’s computer chips is reaching the heat dissipation limits for air-cooled technology. Direct liquid cooling of chips is being considered as a viable alternative. This paper reviews liquid cooling in terms of technological options and challenges. The possibilities presented herein indicate a four-to ten-fold increase in heat flux over the air-cooled systems. The roadmap for single-phase cooling technology is presented to identify research opportunities in meeting the cooling demands of future IC chips. The use of three-dimensional microchannels that incorporate either microstructures in the channel of grooves in the channel surfaces may lead to enhancement in single-phase cooling. A simplified fabrication process is described that can build both classes of three-dimensional microchannels. Proof-of-concept microchannels are presented to demonstrate the efficacy of the fabrication process.