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Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

Materials EngineeringMaterials ScienceIntermetallic CompoundsEngineeringSevere Plastic DeformationMechanical EngineeringMetallurgical InteractionMicrostructural EvolutionMicrostructure-strength RelationshipCermetMicrostructureMetal Processing