Journal of Micromechanics and Microengineering · 2014 · 1.5K citations · 22 references
Natural SciencesMaterials EngineeringMaterials ScienceMechanical Behavior Of MaterialsPolymer EngineeringPolymer MaterialsElastomeric PolymersFabrication MaterialsMicrofluidic DevicesMicrofluidicsSoft LithographySoft MaterialsCompressive ModulusCompressive StrainCompressive StrengthCompressive Strength TestingTensile StrengthUltimate Compressive StrengthUltimate Strength AnalysisUltimate Tensile Strength
Polydimethylsiloxane (PDMS) elastomers are extensively used for soft lithographic replication of microstructures in microfluidic and micro-engineering applications. Elastomeric microstructures are commonly required to fulfil an explicit mechanical role and accordingly their mechanical properties can critically affect device performance. The mechanical properties of elastomers are known to vary with both curing and operational temperatures. However, even for the elastomer most commonly employed in microfluidic applications, Sylgard 184, only a very limited range of data exists regarding the variation in mechanical properties of bulk PDMS with curing temperature. We report an investigation of the variation in the mechanical properties of bulk Sylgard 184 with curing temperature, over the range 25 C to 200 C. PDMS samples for tensile and compressive testing were fabricated according to ASTM standards. Data obtained indicates variation in mechanical properties due to curing temperature for Young's modulus of 1.32-2.97 MPa, ultimate tensile strength of 3.51-7.65 MPa, compressive modulus of 117.8-186.9 MPa and ultimate compressive strength of 28.4-51.7 GPa in a range up to 40% strain and hardness of 44-54 Sh A .
22
Younan Xia, George M. Whitesides · Annual Review of Materials Science · 1998 · 4.6K citations
Fabrication of microfluidic devices using polydimethylsiloxane
James Friend, Leslie Y. Yeo · Biomicrofluidics · 2010 · 416 citations · Full text