ECS Electrochemistry Letters · 2014 · 10 citations · 0 references
Natural SciencesChemistryMaterials ScienceElectrochemical EngineeringElectrochemistryInorganic ChemistryElectrochemical KineticsElectrode KineticsElectrode MaterialsElectrode-electrolyte InterfacesInterfacial ElectrochemistryWorking ElectrodesElectrochemical MeasurementsElectrochemical MechanismsElectrode InterfacesElectrode Reaction KineticsElectrode Reaction MechanismsElectrodeposition Current DistributionKinetics Of Electrode ReactionsMetal Ion Bridge Formation
Free cuprous formed inside a trench accelerates the trench via bottom. A drastic increase in current has been measured with N2 bubbling by initially dissolving the trench bottom copper electrode. This increases with the narrower trench bottom width. With O2 bubbling, however, this shows a very low current. These differences in current densities with the O2 gas concentration in the electrolyte must be caused by the formed SPS and cuprous complex. The SPS and cuprous complex is free and not adsorbing on the electrode. For the basic bath with only Cl−, the current shows a marked increase, which is related to the electron bridge formation of Cl−.