IEEE Transactions on Advanced Packaging · 2002 · 64 citations · 10 references
EngineeringElectrical EngineeringMaterials ScienceCircuit TheoryElectromagneticsMicroelectronicsDevice ModelingDevice SimulationDielectric PropertiesDielectric ResponseDielectricsTransmission LinesDispersive MediaHigh-speed InterconnectsLossy Transmission LinesMulticonductor Transmission LinesPermittivityTransmission Line AnalysisTransmission Line ModelingTransmission Line Theory
The development of a physically consistent multiconductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is presented which constructs SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion. Simulations using wideband measurement data of alumina demonstrate the effect of the Debye based permittivity model.
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