Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

Karaj Branch, J. Morsey, A.C. Cangellaris, A.E. Ruehli

IEEE Transactions on Advanced Packaging · 2002 · 64 citations · 10 references

Concepts

Abstract

The development of a physically consistent multiconductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is presented which constructs SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion. Simulations using wideband measurement data of alumina demonstrate the effect of the Debye based permittivity model.

References

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