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High Ge Content of SiGe Channel pMOSFETs on Si (110) Surfaces
17
Citations
13
References
2010
Year
EngineeringSemiconductor MaterialsSilicon On InsulatorSemiconductor DeviceSemiconductorsNanoelectronicsElectronic PackagingHigh Ge ContentSemiconductor TechnologyElectrical EngineeringPhysicsBias Temperature InstabilitySemiconductor MaterialSemiconductor Device FabricationBulk SiSaturation DrainHole MobilityMicroelectronicsApplied PhysicsSige Channel PmosfetsOptoelectronics
The characteristics of Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.2</sub> Ge <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.8</sub> channel PFETs fabricated directly on Si (110) surfaces have been investigated. The saturation drain current and the hole mobility of a Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.2</sub> Ge <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.8</sub> (110) PFET are enhanced by 70% and by 80% for the <110> channel, as compared with that of a bulk Si (110) PFET. For comparison with a Si (100) PFET, a SiGe <110>/(110) PFET has ~ 200% hole mobility enhancement. The performance difference of the SiGe <110>/(110) and <100>/(110) PFET is about 2.7 times when considering mobility, and these effects are explained.
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