Micromachining of a piezocomposite transducer using a copper vapor laser

Abstract

A 1-3 piezocomposite transducer with front face dimensions of 2 x 2 mm has been micromachined using a copper vapor laser. The device consists of PZT5A piezoceramic pillars with a 65-micron pitch suspended in a low viscosity thermosetting polymer. The kerf width is 13 microns, and the transducer thickness is 170 microns, making the device suitable for ultrasonic reception at frequencies close to 10 MHz.