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Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

Materials ScienceUltrasonic Flexural VibrationEngineeringMaterial ProcessingMicrofabricationMechanical EngineeringAbrasive ParticlesAcoustic CavitationAbrasive ProcessChemical Mechanical PolishingMechanics Of MaterialsMicrostructureAbrasive Machining