Publication | Closed Access
A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn–Ag–Cu Ball-Grid-Array Packages
20
Citations
15
References
2009
Year
EngineeringLife PredictionMechanical EngineeringFinite-element-based Modeling MethodologyDeterioration ModelingReliability EngineeringSystems EngineeringElectronic PackagingLead-free Solder BallsService Life PredictionElectrical EngineeringEfficient MethodologyHardware ReliabilityStructural Health MonitoringReliability PredictionLow-cycle FatiguePhysic Of FailureSn–ag–cu Ball-grid-array PackagesStructural MechanicsMechanics Of Materials
A finite-element-based modeling methodology for predicting the part-on-board fatigue life of lead-free solder balls is presented. The computationally efficient methodology is calibrated with a wide assortment of published test data.
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