2002 · 10 citations · 5 references
EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringWireless CommunicationsMicrowave Integrated CircuitsMicrowave MeasurementsMicrowave PackagingMicrowave Transmission LinesMillimeter-wave CommunicationsRadio-frequency Integrated CircuitsInsertion LossInsertion Loss MeasurementMillimeter-wave Integrated CircuitsMonolithic Microwave Integrated Circuit DesignQuartzRadio-frequency PackagingReturn Loss
The authors have designed, fabricated, and tested an advanced millimeter-wave package. The package consists of a gold-plated Kovar base, a 5-mil quartz substrate, a quartz ring, and a top cover. For the complete test structure, including two RF feedthroughs integrated with a 50-ohm line, the measured return loss is less than 1.2 dB up to 35 GHz. Assuming the package to be asymmetrical, the return loss and insertion loss for each RF feedthrough port can be estimated to be 21 dB and 0.4 dB, respectively.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Waveguide-to-microstrip transitions for millimeter-wave applications
Analysis of conductor-backed coplanar waveguide
Y.C. Shih, T. Itoh · Electronics Letters · 1982 · 111 citations
L.C.T. Liu, C.S. Liu, Julie Kessler et al. · IEEE Transactions on Microwave Theory and Techniques · 1986 · 18 citations
A new packaging technology for GaAs MMIC modules
Hisashi Tomimuro, F. Ishitsuka, Norio Sato et al. · 2003 · 16 citations