Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions

Calculation of Diffusion Penetration Curves for Surface and Grain Boundary Diffusion

J. C. Fisher · Journal of Applied Physics · 1951 · 1.2K citations

Natural Sciences, Materials Engineering, Materials Science +14

Phase-field model for binary alloys

Seong Gyoon Kim, Won Tae Kim, Toshio Suzuki · Physical review. E, Statistical physics, plasmas, fluids, and related interdisciplinary topics · 1999 · 1.1K citations

Natural Sciences, Materials Science, Physics +17

Phase-field model for isothermal phase transitions in binary alloys

A. A. Wheeler, W. J. Boettinger, G. B. McFadden · Physical Review A · 1992 · 979 citations

Natural Sciences, Materials Science, Physics +17

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 610 citations

Natural Sciences, Materials Engineering, Materials Science +11

A generalized field method for multiphase transformations using interface fields

Ingo Steinbach, F. Pezzolla · Physica D Nonlinear Phenomena · 1999 · 596 citations

Engineering, Computational Engineering, Materials Engineering +7