M.S. Park

Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions

M.S. Park, Sean Gibbons, Raymundo Arróyave · Acta Materialia · 2012 · 103 citations

Natural Sciences, Materials Engineering, Materials Science +17

Early stages of intermetallic compound formation and growth during lead-free soldering

M.S. Park, Raymundo Arróyave · Acta Materialia · 2010 · 101 citations

Natural Sciences, Materials Engineering, Materials Science +13

Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free soldering

M.S. Park, Raymundo Arróyave · Acta Materialia · 2011 · 86 citations

Natural Sciences, Materials Engineering, Materials Science +14

Phase-field simulations of intermetallic compound evolution in Cu/Sn solder joints under electromigration

M.S. Park, Sean Gibbons, Raymundo Arróyave · Acta Materialia · 2013 · 57 citations

Natural Sciences, Materials Engineering, Materials Science +15

Experimental and computational study of the morphological evolution of intermetallic compound (Cu6Sn5) layers at the Cu/Sn interface under isothermal soldering conditions

M.S. Park, M.K. Stephenson, Carrie Urbanik Shannon et al. · Acta Materialia · 2012 · 39 citations

Natural Sciences, Materials Engineering, Materials Science +17