IEEE Transactions on Electron Devices · 1999 · 120 citations · 0 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsPhotovoltaic DevicesPhotovoltaic MaterialsSemiconductor Device MaterialsSilicon MaterialsSolar CellsSolar Photovoltaic SystemsBackside IlluminationCrystalline SiliconCrystalline Silicon Solar CellsDiffusion LengthManufacturingSilicon Solar CellsSilicon WafersSolar Cell Fabrication
One of the most effective approaches for a cost reduction of crystalline silicon solar cells is the better utilization of the crystals by cutting thinner wafers. However, such thin silicon wafers must have sufficient mechanical strength to maintain a high mechanical yield in cell and module manufacturing. The electrical performance of thin cells drops strongly with decreasing cell thickness if solar cell manufacturing technologies without a backside passivation or a back-surface-field (BSF) are applied. However, with the application of a BSF, stable efficiencies of over 17%, even with decreasing cell thickness, have been reached. Thin solar cells show lower photodegradation, as is normally observed for Cz-silicon cells with today's standard thickness (about 300 /spl mu/m) because of a higher ratio of the diffusion length compared to the cell thickness. Cells of about 100-150 /spl mu/m thickness fabricated with the production Cz-silicon show almost no photodegradation. Furthermore, thin boron BSF cells have a pronounced efficiency response under backside illumination. The backside efficiency increases with decreasing cell thickness and reaches 60% of the frontside cell efficiency for 150 /spl mu/m solar cells and also for solar modules assembled of 36 cells of a thickness of 150 /spl mu/m. Assuming, for example, a rearside illumination of 150 W/m/sup 2/, this results in an increased module power output of about 10% relatively.