IEEE Journal of Solid-State Circuits · 2011 · 41 citations · 13 references
Electrical EngineeringBiomedical SensorsEngineeringMicrofabricationCalibrationGyroscopeComputer EngineeringPrototype SensorStacked DiesSensor InterfaceCapacitive 2-Axis Micro-gyroscopeInstrumentationElectronic InstrumentationMicroelectronicsMa 4.3Micro-electromechanical System
The interface for a capacitive 2-axis micro-gyroscope is implemented in a 0.35-μm HVCMOS technology with a total area of 4.3 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> . The ASIC comprises the complete analog interface electronics for the gyroscope, while the focus of the design is in maintaining low supply current and in reducing the chip area. The paper reports the design of reference circuits, high-voltage generation, drive-loop and the capacitive open-loop readout circuits. The prototype sensor that is measured is assembled by directly wire-bonding the stacked dies comprising the interface electronics and the sensor element. The noise floors of the two sensors are 0.028°/s/√{Hz} for z-axis and 0.032°/s/√{Hz} for y-axis. The supply current of the chip is 2.2 mA from a 3 V-supply.
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Micromachined inertial sensors
N. Yazdi, Farrokh Ayazi, K. Najafi · Proceedings of the IEEE · 1998 · 1.8K citations
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Surface Micromachined Z-Axis Vibratory Rate Gyroscope
William Clark, Roberto Horowitz, Roger T. Howe · 1996 · 206 citations · Full text