2008 · 12 citations · 3 references
EngineeringElectrical EngineeringMechanical EngineeringHeat TransferMicroelectronicsMicrofabricationHeat ConductionHeat Transfer AnalysisMicrofabrication MaterialsThermal DesignThermal ManagementThermal Management MaterialsCritical Thermal LimitsMicro-scale Heat TransferMicroscale Heat ConductionMillimeter-wave Integrated CircuitsPower OutputPower Output AnalysisPower Output CapabilityThermal Management In High-frequency Devices
Computations of operating temperatures in microfabricated upper-millimeter-wave sheet beam traveling wave structures are provided. The studies include the effects of different cooling techniques and construction materials. The scaling of output power capability vs. frequency, as constrained by thermal limits, is also presented.
3
J Calam, Robert E. Myers, Franklin N. Wood et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 45 citations