IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 14 citations · 7 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsOptoelectronicsSemiconductor DevicesIntegrated OpticsInterconnect TechnologyOptical Communication SystemsOptical InterconnectsOptical SwitchingPhotonic Integrated CircuitsAsynchronous Transfer ModeAsynchronous Transfer Mode SwitchingAutomatic Temperature ControlModule DesignMultichip ModulesOptical Interconnect Architectures
This paper describes 2.8-Gbit/s, 5-channel optical transmitter and receiver modules for board-to-board interconnection in asynchronous transfer mode (ATM) switching systems. These modules are constructed of optical and electrical submodules. The optical submodule mainly consists of a multimode-fiber array and an optical device array. The electrical submodule is constructed by a multichip module technique with GaAs IC's and multilayer ceramic substrates. The advantage of the submodule fabric is that the submodules are independently assembled after testing. Error-free 250-m transmission is successfully demonstrated over a wide range of temperatures (from 25/spl deg/C to 60/spl deg/C), without automatic power control and automatic temperature control circuits in the optical transmitter module.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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