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Patterning-induced strain relief in single lithographic SiGe nanostructures studied by nanobeam x-ray diffraction
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Citations
43
References
2012
Year
EngineeringElectron-beam LithographySilicon On InsulatorNanobeam X-ray DiffractionBeam LithographyPatterning-induced Strain ReliefNanoelectronicsNanoscale ModelingNanometrologyNanoscale ScienceNanolithography MethodMaterials ScienceCrystalline DefectsPhysicsNanotechnologyMicroelectronicsAnisotropic Strain RelaxationMicrostructureDislocation InteractionMicrofabricationContinuous Sige LayerStrain RelaxationApplied PhysicsNanofabricationDiffractive Optic
The continued downscaling in SiGe heterostructures is approaching the point at which lateral confinement leads to a uniaxial strain state, giving high enhancements of the charge carrier mobility. Investigation of the strain relaxation as induced by the patterning of a continuous SiGe layer is thus of scientific and technological importance. In the present work, the strain in single lithographically defined low-dimensional SiGe structures has been directly mapped via nanobeam x-ray diffraction. We found that the nanopatterning is able to induce an anisotropic strain relaxation, leading to a conversion of the strain state from biaxial to uniaxial. Its origin is fully compatible with a pure elastic deformation of the crystal lattice without involving plastic relaxation by injection of misfit dislocations.
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