LED packaging by ink‐jet microdeposition of high‐viscosity resin and phosphor dispersion

Abstract

Abstract— An ink‐jet‐printing method applied to the microdeposition of high‐viscosity resin, including optimization of phosphor dispersion for light‐emitting‐diode (LED) packaging was examined for the first time. An ultrasonic ink‐jet‐printing method was used, in which ink droplets are ejected by a focused ultrasonic beam from a nozzle‐less printhead. To fabricate white LEDs, high‐viscosity phosphor‐dispersed resin was deposited to form an encapsulant dome. Two types of methods to control phosphor sedimentation for color uniformity were examined; one is heating the lead frame during the resin deposition, and the other is hydrophobic surface treatment of the lead frame base enabling the fabrication of a small encapsulant dome. For light direction control, a silicone micro lens was deposited on an encapsulant dome using the ink‐jet method. The results show that ultrasonic ink‐jet printing is an applicable technique to optimize and modify on‐demand optical characteristics of LED devices.